The global Test and Burn-in Sockets market was valued at 1144.67 Million USD in 2021 and will grow with a CAGR of 6.07% from 2021 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips.An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use. The main producers in the industry are Yamaichi Electronics, Cohu and Enplas, which accounted for 12.36%, 10.58% and 9.42% of revenues respectively in 2019. By region, consumption in the Asia-Pacific region is the highest, at more than 67 percent.

By Market Verdors:

Yamaichi Electronics

Cohu

Enplas

ISC

Smiths Interconnect

LEENO

Sensata Technologies

Johnstech

Yokowo

WinWay Technology

Loranger

Plastronics

OKins Electronics

Ironwood Electronics

3M

M Specialties

Aries Electronics

Emulation Technology

Qualmax

Micronics

Essai

Rika Denshi

Robson Technologies

Translarity

Test Tooling

Exatron

Gold Technologies

JF Technology

Advanced

Ardent Concepts

By Types:

Burn-in Socket

Test Socket

By Applications:

Memory

CMOS Image Sensor

High Voltage

RF

SOC, CPU, GPU, etc.

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

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