Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from South Korea, China Taiwan, Japan, United States and Germany. Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from South Korea; Test Research (TRI) and Jet Technology from China Taiwan; CyberOptics Corporation, Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. Koh Young, Test Research (TRI) and Sinic-Tek Vision Technology occupied more than 50% of the global market.

Market Analysis and Insights: Global Solder Paste Inspection (SPI) System Market
In 2020, the global Solder Paste Inspection (SPI) System market size was US$ 264.5 million and it is expected to reach US$ 397.7 million by the end of 2027, with a CAGR of 6.0% during 2021-2027.
Global Solder Paste Inspection (SPI) System Scope and Market Size
Solder Paste Inspection (SPI) System market is segmented by region, by country, company, type, application and by sales channels. Players, stakeholders, and other participants in the global Solder Paste Inspection (SPI) System market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region, by country, company, type, application and by sales channels for the period 2016-2027.

Segment by Type, the Solder Paste Inspection (SPI) System market is segmented into
In-line SPI System
Off-line SPI System

Segment by Application, the Solder Paste Inspection (SPI) System market is segmented into
Automotive Electronics
Consumer Electronics
Industrials
Others

Regional and Country-level Analysis:
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

Competitive Landscape and Solder Paste Inspection (SPI) System Market Share Analysis
Solder Paste Inspection (SPI) System market competitive landscape provides details and data information by companies. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2016-2021. It also offers detailed analysis supported by reliable statistics on sale and revenue by players for the period 2016-2021. Details included are company description, major business, Solder Paste Inspection (SPI) System product introduction, recent developments, Solder Paste Inspection (SPI) System sales by region, type, application and by sales channel.

The major companies include:
Koh Young
Test Research, Inc (TRI)
CKD Corporation
CyberOptics Corporation
MIRTEC CO., LTD.
PARMI Corp
Viscom AG
ViTrox
Mycronic (Vi TECHNOLOGY)
MEK Marantz Electronics
Pemtron
SAKI Corporation
Caltex Scientific
ASC International
Jet Technology
Sinic-Tek Vision Technology
Shenzhen ZhenHuaXing
Shenzhen JT Automation Equipment
JUTZE Intelligence Technology
Shenzhen Chonvo Intelligence