Semiconductor Encapsulants are designed for use in wire-bond packages or components that require environmental protection or enhanced reliability. Including underfill, COB, etc.
Market Analysis and Insights: Global Semiconductor Grade Encapsulants Market
Due to the COVID-19 pandemic, the global Semiconductor Grade Encapsulants market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, One Component accounting for % of the Semiconductor Grade Encapsulants global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Automotive segment is altered to an % CAGR throughout this forecast period.
China Semiconductor Grade Encapsulants market size is valued at US$ million in 2021, while the US and Europe Semiconductor Grade Encapsulants are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Semiconductor Grade Encapsulants landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of Semiconductor Grade Encapsulants include Henkel, 3M, Shin-Etsu MicroSi, Lord, Zymet, Won Chemical, Panacol, Namics Corporation and Shenzhen Dover, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Semiconductor Grade Encapsulants capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Semiconductor Grade Encapsulants by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Semiconductor Grade Encapsulants Scope and Segment
Semiconductor Grade Encapsulants market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Semiconductor Grade Encapsulants market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
One Component
Two Component
Segment by Application
Automotive
Consumer Electronics
Others
By Company
Henkel
3M
Shin-Etsu MicroSi
Lord
Zymet
Won Chemical
Panacol
Namics Corporation
Shenzhen Dover
Bondline
Darbond
Nagase
Hanstars
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE