The global Lead Frame market was valued at 393.02 Million USD in 2021 and will grow with a CAGR of 4.52% from 2021 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.The lead frame market itself has gone from a growth market to the mature phase, resulting in over-commoditization of lead frame products. According to the report, global revenue for lead frame was valued at $ 3781.24 million in 2017, and is expected to generate revenue of $ 4926.21 million by end of 2023, growing at a CAGR of 4.51% between 2017 and 2023. Sumitomo Metal Mining Co., Ltd. (SMM) has withdrawn from the lead frame business, based on an assessment of the changing business environment. The lead frame market itself has gone from a growth market to the mature phase, resulting in over-commoditization of lead frame products. Moreover, the emergence of Chinese local manufacturers has intensified competition for these products. On March 17, 2017, Chang Wah Technology purchased SH Asia Pacific Pte. Ltd., a Singapore-based investment company, from SH Materials Co., Ltd. (SHM). In 2017, Jin Lin Technology has merger and acquisition three power device lead manufacturer from Japan Sumitomo Metals (SMM), which are SH Precision Co., Ltd (Japan), Suzhou SH Precision Co., Ltd (China) and Malaysian SH Precision Sdn Bhd (Malaysia). Nowadays, Jih Lin Technology is status as the top 3 power devices lead frame manufacturer of the world.

By Market Verdors:

Mitsui High-tec

ASM Pacific Technology

Shinko

Samsung

Chang Wah Technology

SDI

POSSEHL

Kangqiang

Enomoto

JIH LIN TECHNOLOGY

DNP

Fusheng Electronics

LG Innotek

Hualong

I-Chiun

Jentech

QPL Limited

Dynacraft Industries

Yonghong Technology

WuXi Micro Just-Tech

By Types:

Stamping Process Lead Frame

Etching Process Lead Frame

By Applications:

Integrated Circuit

Discrete Device

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

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