IC chip packages refer to materials that contain semiconductor devices. Encapsulation is an enclosure that surrounds circuit material to protect it from corrosion or physical damage and to allow mounting of electrical contacts that connect it to a printed circuit board (PCB). IC chip packaging is capable of providing more and more I/O interconnects to smaller and smaller dies (bare chips).
This report contains market size and forecasts of IC Chip Packaging and Testing in global, including the following market information:
Global IC Chip Packaging and Testing Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global IC Chip Packaging and Testing Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five IC Chip Packaging and Testing companies in 2021 (%)
The global IC Chip Packaging and Testing market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
BGA Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of IC Chip Packaging and Testing include ASE, Amkor Technology, SPIL, Powertech Technology, UTAC, Chipbond Technology, Hana Micron, OSE and Walton Advanced Engineering, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the IC Chip Packaging and Testing manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Chip Packaging and Testing Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global IC Chip Packaging and Testing Market Segment Percentages, by Type, 2021 (%)
BGA
LGA
SiP
FC
Others
Global IC Chip Packaging and Testing Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global IC Chip Packaging and Testing Market Segment Percentages, by Application, 2021 (%)
Communications
Consumer Electronics
Electric Vehicles
Aerospace
Others
Global IC Chip Packaging and Testing Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global IC Chip Packaging and Testing Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Chip Packaging and Testing revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies IC Chip Packaging and Testing revenues share in global market, 2021 (%)
Key companies IC Chip Packaging and Testing sales in global market, 2017-2022 (Estimated), (K Units)
Key companies IC Chip Packaging and Testing sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE
Amkor Technology
SPIL
Powertech Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Siliconware Precision Industries
ITEQ
JCET
TongFu Microelectronics
Tianshui Huatian Technology
Chipmore Technology
China Resources Microelectronics
Forehope Electronic
Wafer Level CSP
Chizhou HISEMI Electronic Technology
Keyang
Leadyo IC Testing