Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes

Market Analysis and Insights: Global Automotive Power Module Packaging Market
The global Automotive Power Module Packaging market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Automotive Power Module Packaging market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Automotive Power Module Packaging market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Automotive Power Module Packaging market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Automotive Power Module Packaging market.

Global Automotive Power Module Packaging Scope and Market Size
Automotive Power Module Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Automotive Power Module Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
Intelligent Power Module
SiC Module
GaN Module
Other

Segment by Application
Battery Electric Vehicles (BEV)
Plug-in Hybrid Electric Vehicles (PHEV)

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
Amkor Technology
Kulicke and Soffa Industries
Infineon Technologies
STMicroelectronics
Fuji Electric
Toshiba Electronic Device & Storage Corporation
Semikron
STATS ChipPAC
Starpower Semiconductor
Bosch
Toyota
Mitsubishi